There is a law (a prediction actually) in electronics, which everyone knew will break one day; because it's impossible to stay on the explosive growth trajectory predicted by that law. Surprisingly, this law still has life and kicking. Some of you may already figure out that prediction by now; yes, it's the famous Moore's law (prediction by the co-founder of Fairchild Semiconductor and Intel). He, in 1965 stated that the number of components in an integrated circuit will double every year; he also projected that this state of growth will continue for at least another decade. In 1975, he revised the forecasting of doubling-in to every two years.
There is a wonderful animation about Moore's law over decades here. @datagrapha
Now, the new inventions by IBM researchers at Albany gave another life for that law. As per IBM, with new methodology, it's possible to pack two-thirds of components more than what was previously possible. Translating this to common language; it says - using this process a smartphone can run 45% faster at the same time consuming only 1/4 energy. Currently, chip makes uses a design called FinNET - where electrons flow vertically. IBM took this to next level, by stacking one nanosheet over another one. New process called '2 nanometer' is three generations ahead of current technology. Since IBM don't have a chip-making facility now, this might be licensed to Intel or some other companies. It may take some more years for these chips to power our phones and other electronics equipments.
This time it may take some time for Samsung and TSMC (from Taiwan) to catch up.
Wonderful news at the time of Covid.
Sajeev.
References
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